Panasonic Industry Co., Ltd.
Product introduction
- Material for SIP/Flip Chip Packaging (MUF and CUF)
- Material for power module and power device
- Surface mounting semiconductor encapsulation materials for memory
- Material for WLP, PLP
- Materials for mounting / Reinforcement
Application products
- IC PKGs for mobile / Communication devices
- Power module
- DRAM and NAND
- Advanced devices
- Automotive camera modules / Automotive ECU