- Material for SIP/Flip Chip Packaging (MUF and CUF)
- Material for power module and power device
- Surface mounting semiconductor encapsulation materials for memory
- Material for WLP, PLP
- Materials for mounting / Reinforcement
- Flex-rigid multilayer board
- Coreless board
- Build-UP boards
- Cavity boards
- Magic-regin carrier
- Ceramic capacitors
- Inductors
- Power storage devices
- ELNA (Aluminum electrolytic capacitors)
- Balun transformers
- High-frequency products
- Noise suppression components
- Electronic parts sales
- Commissioned development
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